Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6432750 | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof | Gi-young Jeon, Byeong Gon KIM, Eun Ho Lee | 2002-08-13 |