Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6483043 | Chip assembly with integrated power distribution between a wafer interposer and an integrated circuit chip | — | 2002-11-19 |
| 6483330 | Method for selecting components for a matched set using wafer interposers | — | 2002-11-19 |
| 6392428 | Wafer level interposer | Cecil E. Smith, Jr. | 2002-05-21 |