Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6465158 | Semiconductor wafer dividing method | — | 2002-10-15 |
| 6371100 | Machining apparatus capable of saving different fluids in machining | — | 2002-04-16 |
| 6361404 | Precision cutting apparatus and cutting method using the same | Souichi Ishiwata, Takayuki Umahashi | 2002-03-26 |
| 6344402 | Method of dicing workpiece | — | 2002-02-05 |
| 6341740 | Cutting-and-transferring system and pellet transferring apparatus | Takayuki Mahashi, Shinichi Namioka, Takeo Hidaka, Masahiro Yoshii | 2002-01-29 |