CL

Cheng-Wei Lee

TSMC: 2 patents #107 of 614Top 20%
📍 New Taipei, TW: #50 of 273 inventorsTop 20%
Overall (2002): #70,751 of 266,432Top 30%
2
Patents 2002

Issued Patents 2002

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6479376 Process improvement for the creation of aluminum contact bumps Kun-Ming Huang, Ding-Jeng Yu 2002-11-12
6458683 Method for forming aluminum bumps by CVD and wet etch 2002-10-01