Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6395582 | Methods for forming ground vias in semiconductor packages | Ju Yung Sohn, Seung Ryul Ryu | 2002-05-28 |
| 6373131 | TBGA semiconductor package | — | 2002-04-16 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6395582 | Methods for forming ground vias in semiconductor packages | Ju Yung Sohn, Seung Ryul Ryu | 2002-05-28 |
| 6373131 | TBGA semiconductor package | — | 2002-04-16 |