Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6380106 | Method for fabricating an air gap metallization scheme that reduces inter-metal capacitance of interconnect structures | Young Way Teh, Ting Cheong Ang, Alex See, Yong Kong Siew | 2002-04-30 |