Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6383835 | IC package having a conductive material at least partially filling a recess | Fumio Hata, Hisatane Komori | 2002-05-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6383835 | IC package having a conductive material at least partially filling a recess | Fumio Hata, Hisatane Komori | 2002-05-07 |