Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6493228 | Heat radiation packaging structure for an electric part and packaging method thereof | Hirotoshi Oda, Hisafumi Maruo, Hiroyuki Ashiya, Yasutaka Nagaoka, Yayoi Maki | 2002-12-10 |
| 6372998 | Electrical component connecting structure of wiring board | Hiroyuki Ashiya, Yayoi Maki | 2002-04-16 |