Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498260 | Thermally degradable epoxy underfills for flip-chip applications | Lejun Wang, Haiying Li | 2002-12-24 |
| 6380322 | Reworkable high temperature adhesives | Jiali Wu | 2002-04-30 |