Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6413799 | Method of forming a ball-grid array package at a wafer level | — | 2002-07-02 |
| 6388335 | Integrated circuit package formed at a wafer level | — | 2002-05-14 |
| 6376914 | Dual-die integrated circuit package | Julius Kovats | 2002-04-23 |
| 6344401 | Method of forming a stacked-die integrated circuit chip package on a water level | — | 2002-02-05 |