Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6362090 | Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method | Kyung Wook Paik, Jae-Woong Nah, Myung Jin Yim | 2002-03-26 |