Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6404212 | Testing of BGA and other CSP packages using probing techniques | Rajiv Mehta, Liop-Jin Yap, Chee Keong Tan | 2002-06-11 |
| 6355199 | Method of molding flexible circuit with molded stiffener | John Briar | 2002-03-12 |