Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6437427 | Lead frame used for the fabrication of semiconductor packages and semiconductor package fabricated using the same | — | 2002-08-20 |
| 6339252 | Electronic device package and leadframe | Eulogia A. Niones, Nhun Thun Kham, Ludovico E. Bancod, Sean T. Crowley | 2002-01-15 |