Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479887 | Circuit pattern tape for wafer-scale production of chip size semiconductor packages | Dae Byung Kang | 2002-11-12 |
| 6428641 | Method for laminating circuit pattern tape on semiconductor wafer | Woo-Hyun Kong, Chang-Bok Lee, Sung Jin Yang | 2002-08-06 |