Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492197 | Trilayer/bilayer solder bumps and fabrication methods therefor | — | 2002-12-10 |
| 6418033 | Microelectronic packages in which second microelectronic substrates are oriented relative to first microelectronic substrates at acute angles | — | 2002-07-09 |
| 6389691 | Methods for forming integrated redistribution routing conductors and solder bumps | Joseph Daniel Mis | 2002-05-21 |
| 6392163 | Controlled-shaped solder reservoirs for increasing the volume of solder bumps | Paul A. Magill | 2002-05-21 |
| 6388203 | Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby | Paul A. Magill | 2002-05-14 |