Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6424023 | Leadframe for molded semiconductor package and semiconductor package made using the leadframe | Seung-Mo Kim, Jin A Lee | 2002-07-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6424023 | Leadframe for molded semiconductor package and semiconductor package made using the leadframe | Seung-Mo Kim, Jin A Lee | 2002-07-23 |