Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6474355 | Particle removing vacuum system for assembly of FBGA packages | Kasin Jirawat, Chuawalit Klanruengsang, Khanchit Suphanpesat | 2002-11-05 |
| 6415975 | Determination of quality of bonding between a conductive ball and a conductive pad within an IC package | Prakorn Vijchulata | 2002-07-09 |