Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6403221 | Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same | Shigeo Nakamura | 2002-06-11 |
| 6380343 | Curable resin composition for overcoat of flexible circuit | Hiroshi Orikabe | 2002-04-30 |
| 6376053 | Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same | Shigeo Nakamura | 2002-04-23 |
| 6376609 | Photosensitive resin and photosensitive resin composition containing the same | Shigeo Nakamura | 2002-04-23 |
| 6335417 | Modified polyimide resin and thermosetting resin composition containing the same | Hiroshi Orikabe | 2002-01-01 |