Issued Patents 2002
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D467884 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-12-31 |
| D467885 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-12-31 |
| D467560 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-12-24 |
| D467231 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-12-17 |
| D465207 | Leadframe matrix for a surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-11-05 |
| 6476442 | Pseudo-Schottky diode | Robert Blattner | 2002-11-05 |
| 6465110 | Metal felt laminate structures | Daniel E. Boss, Scott R. Dobrusky | 2002-10-15 |
| 6452802 | Symmetrical package for semiconductor die | Allen K. Lam, Alex K. Choi | 2002-09-17 |
| D462062 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-08-27 |
| D461784 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-08-20 |
| D461783 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-08-20 |
| D461459 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-08-13 |
| D461172 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-08-06 |
| D461170 | Surface mount package | James Harnden, Anthony Chia, Chu Weibing | 2002-08-06 |
| 6413822 | Super-self-aligned fabrication process of trench-gate DMOS with overlying device layer | Wayne B. Grabowski | 2002-07-02 |