Issued Patents 1989
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4837086 | Adhesive clad insulating substrate used for producing printed circuit boards | Hiroshi Takahashi, Shin Takanezawa, Kiyoshi Nakao | 1989-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4837086 | Adhesive clad insulating substrate used for producing printed circuit boards | Hiroshi Takahashi, Shin Takanezawa, Kiyoshi Nakao | 1989-06-06 |