Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4828886 | Method of applying small drop-shaped quantities of melted solder from a nozzle to surfaces to be wetted and device for carrying out the method | — | 1989-05-09 |
| 4817277 | Method of manufacturing an electrically conductive adhesive bond | Wolfgang Thews | 1989-04-04 |