Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4879629 | Liquid cooled multi-chip integrated circuit module incorporating a seamless compliant member for leakproof operation | Kyle Halkola | 1989-11-07 |
| 4809134 | Low stress liquid cooling assembly | James H. Rogneby | 1989-02-28 |
| 4807019 | Cavity-up-cavity-down multichip integrated circuit package | — | 1989-02-21 |