Issued Patents 1989
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4879633 | Direct bond circuit assembly with ground plane | — | 1989-11-07 |
| 4860164 | Heat sink apparatus with electrically insulative intermediate conduit portion for coolant flow | — | 1989-08-22 |
| 4831723 | Direct bond circuit assembly with crimped lead frame | — | 1989-05-23 |
| 4818895 | Direct current sense lead | — | 1989-04-04 |
| 4819042 | Isolated package for multiple semiconductor power components | — | 1989-04-04 |