HL

Heinz K. Laupenmuhlen

SA Siemens Aktiengesellschaft: 1 patents #208 of 995Top 25%
📍 Hemhofen, DE: #1 of 4 inventorsTop 25%
Overall (1989): #106,594 of 140,708Top 80%
1
Patents 1989

Issued Patents 1989

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
4812490 Epoxy resin molding compounds Wolfgang Kleeberg, Heinz Hacker, Jürgen Huber, Dieter Wilhelm 1989-03-14