Issued Patents 1989
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4888449 | Semiconductor package | Jacob Crane, Barry C. Johnson, Sheldon H. Butt | 1989-12-19 |
| 4883778 | Products formed of a ceramic-glass-metal composite | Narendra N. SinghDeo, Sheldon H. Butt | 1989-11-28 |
| 4882212 | Electronic packaging of components incorporating a ceramic-glass-metal composite | Narendra N. SinghDeo, Sheldon H. Butt | 1989-11-21 |
| 4872047 | Semiconductor die attach system | Julius C. Fister, Satyam Choudary Cherukuri, Brian E. O'Donnelly | 1989-10-03 |
| 4821151 | Hermetically sealed package | Michael J. Pryor, Narendra N. SinghDeo | 1989-04-11 |
| 4799973 | Process for treating copper-nickel alloys for use in brazed assemblies and product | Eugene Shapiro | 1989-01-24 |