Issued Patents 1989
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4871608 | High-density wiring multilayered substrate | Kazuo Kondo, Hiroshi Iwata, Yoshimasa Shibata | 1989-10-03 |
| 4837408 | High density multilayer wiring board and the manufacturing thereof | Kazuo Kondo, Hiroshi Iwata | 1989-06-06 |
| 4810528 | Process for producing multilayer circuit board | Kazuo Kondo, Hisaharu Shiromizu, Tsuneyuki Sukegawa | 1989-03-07 |
| 4801067 | Method of connecting metal conductor to ceramic substrate | Kazuo Kondo, Tsuneyuki Sukegawa | 1989-01-31 |