Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4890156 | Multichip IC module having coplanar dice and substrate | Steven L. Post | 1989-12-26 |
| 4800421 | Glass bonding means and method | Earl K. Davis, David Reed | 1989-01-24 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4890156 | Multichip IC module having coplanar dice and substrate | Steven L. Post | 1989-12-26 |
| 4800421 | Glass bonding means and method | Earl K. Davis, David Reed | 1989-01-24 |