Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4886641 | Electrical contact spring material made of copper base alloy of high strength and toughness with reduced anisotropy in characteristics | Masao Kobayashi | 1989-12-12 |
| 4872048 | Semiconductor device having copper alloy leads | Hidetoshi Akutsu, Masao Kobayashi | 1989-10-03 |
| 4830086 | Mold member and rapidly solidifying water cooled rotary roll member | Masao Kobayashi, Kazuhiko Tabei | 1989-05-16 |