Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4884124 | Resin-encapsulated semiconductor device | Tatsuhiko Akiyama, Katsuyuki Fukudome | 1989-11-28 |
| 4878610 | Die bonding apparatus | Syuichi Osaka, Toshinobu Banjo | 1989-11-07 |
| 4857989 | Semiconductor device | Katsuyuki Fukudome, Toshinobu Banjo | 1989-08-15 |