MD

Masahiko Denda

📍 Itami, JP: #68 of 171 inventorsTop 40%
Overall (1989): #81,904 of 140,708Top 60%
1
Patents 1989

Issued Patents 1989

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
4871405 Method of bonding a semiconductor to a package with a low and high viscosity bonding agent 1989-10-03