Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4839713 | Package structure for semiconductor device | Yasuhiro Teraoka, Tetsuya Ueda, Haruo Shimamoto, Shigeyuki Nango, Toshinobu Banjo +1 more | 1989-06-13 |
| 4826068 | Outer lead bonding device utilizing tape carriers | Haruo Shimamoto | 1989-05-02 |