Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4857141 | Method of forming holes in semiconductor integrated circuit device | Yasukazu Mase | 1989-08-15 |
| 4853760 | Semiconductor device having insulating layer including polyimide film | Masaharu Aoyama, Jiro Ohshima, Takashi Ajima | 1989-08-01 |