Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4882202 | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits | Abraham M. Holtzman | 1989-11-21 |
| 4816070 | Use of immersion tin and alloys as a bonding medium for multilayer circuits | Abraham M. Holtzman | 1989-03-28 |