Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4835120 | Method of making a multilayer molded plastic IC package | Debendra Mallik | 1989-05-30 |
| 4810671 | Process for bonding die to substrate using a gold/silicon seed | Eric Tosaya | 1989-03-07 |