Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4869781 | Method for fabricating a semiconductor integrated circuit structure having a submicrometer length device element | Wolfgang Euen, Dieter Hagmann | 1989-09-26 |
| 4857383 | Synthetic substrate with adhesive metal layer | Johann Greschner, Friedrich W. Schwerdt | 1989-08-15 |
| 4816115 | Process of making via holes in a double-layer insulation | Eva Horner, Reinhold Muhl | 1989-03-28 |