Issued Patents 1989
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4854495 | Sealing structure, method of soldering and process for preparing sealing structure | Akihiko Yamamoto, Akiomi Kohno, Toshihiri Yamada, Keiji Taguchi, Kazuaki Yokoi | 1989-08-08 |