Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4876177 | Process for producing printed circuit board | Haruo Akahoshi, Kanji Murakami, Akio Tadokoro, Toyofusa Yoshimura | 1989-10-24 |
| 4865888 | Process for electroless copper plating and apparatus used therefor | Haruo Akahoshi, Kanji Murakami, Akio Takokoro, Ritsuji Toba, Toyofusa Yoshimura | 1989-09-12 |
| 4820549 | Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition | Kiyoshi Ozaki, Atsushi Mori, Hideo Tsuda, Kanji Murakami, Motoyo Wajima | 1989-04-11 |