Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4869767 | Process for placing single or multiple patterned layers of conductive material on a substrate | William E. Brown | 1989-09-26 |
| 4804130 | Chip carrier sealing and bonding fixture | Jaime T. F. Kwan | 1989-02-14 |