Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4871617 | Ohmic contacts and interconnects to silicon and method of making same | Manjin J. Kim, Dale M. Brown, Simon S. Cohen, Richard Joseph Saia | 1989-10-03 |
| 4845050 | Method of making mo/tiw or w/tiw ohmic contacts to silicon | Manjin J. Kim, Dale M. Brown, Simon S. Cohen, Richard Joseph Saia | 1989-07-04 |
| 4824802 | Method of filling interlevel dielectric via or contact holes in multilevel VLSI metallization structures | Dale M. Brown, Richard Joseph Saia | 1989-04-25 |