Issued Patents 1989
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4825282 | Semiconductor package having side walls, earth-bonding terminal, and earth lead formed in a unitary structure | — | 1989-04-25 |
JF
Jun Fukaya
Overall (1989): #91,833 of 140,708Top 70%
1
Patents 1989