Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4839717 | Ceramic package for high frequency semiconductor devices | James M. Early, Kevien J. Negus | 1989-06-13 |
| 4796080 | Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate | — | 1989-01-03 |