Issued Patents 1989
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4880567 | Thick film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1989-11-14 |
| 4874550 | Thick-film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1989-10-17 |
| 4863517 | Via fill ink composition for integrated circuits | Ashok N. Prabhu | 1989-09-05 |
| 4856670 | Low temperature processing transfer printing ink | Wayne M. Anderson | 1989-08-15 |
| 4830988 | Dielectric inks for multilayer copper circuits | Ashok N. Prabhu, Wayne M. Anderson | 1989-05-16 |
| 4816615 | Thick film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1989-03-28 |
| 4810420 | Thick film copper via-fill inks | Ashok N. Prabhu, Simon M. Boardman | 1989-03-07 |
| 4808673 | Dielectric inks for multilayer copper circuits | Ashok N. Prabhu, Wayne M. Anderson | 1989-02-28 |
| 4808770 | Thick-film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1989-02-28 |