Issued Patents 1989
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4811893 | Method for bonding copper plate to alumina substrate and process for producing copper/alumina bonded assembly | Naoyuki Kanahara, Tetsuo Furihata | 1989-03-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4811893 | Method for bonding copper plate to alumina substrate and process for producing copper/alumina bonded assembly | Naoyuki Kanahara, Tetsuo Furihata | 1989-03-14 |