Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4814009 | Electroless copper plating solution | Koji Kondo, Katuhiko Murakawa, Kaoru Nomoto, Futoshi Ishikawa, Nobumasa Ishida | 1989-03-21 |
| 4812897 | Semiconductor element sealing structure | Ryoichi Narita, Toshio Sonobe, Hitoshi Ito, Osamu Takenaka, Junji Sugiura | 1989-03-14 |