Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4842699 | Method of selective via-hole and heat sink plating using a metal mask | Chang-Hwang Hua, Simon S. Chan | 1989-06-27 |
| 4808273 | Method of forming completely metallized via holes in semiconductors | Chang-Hwang Hua, Simon S. Chan | 1989-02-28 |