Issued Patents 1982
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4314270 | Hybrid thick film integrated circuit heat dissipating and grounding assembly | — | 1982-02-02 |
SI
Shiro Iwatani
Overall (1982): #31,382 of 81,411Top 40%
1
Patents 1982