MR

Morton D. Reeber

IBM: 2 patents #45 of 788Top 6%
📍 Shrub Oak, NY: #1 of 2 inventorsTop 50%
🗺 New York: #278 of 3,580 inventorsTop 8%
Overall (1982): #9,791 of 81,411Top 15%
2
Patents 1982

Issued Patents 1982

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
4360142 Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate Charles L. Carpenter, Joseph F. Fugardi, Lawrence V. Gregor, Peter S. Grosewald 1982-11-23
4312012 Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant Rudolf G. Frieser 1982-01-19